JPH0423134U - - Google Patents
Info
- Publication number
- JPH0423134U JPH0423134U JP6383390U JP6383390U JPH0423134U JP H0423134 U JPH0423134 U JP H0423134U JP 6383390 U JP6383390 U JP 6383390U JP 6383390 U JP6383390 U JP 6383390U JP H0423134 U JPH0423134 U JP H0423134U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- heat sink
- semiconductor device
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6383390U JPH0423134U (en]) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6383390U JPH0423134U (en]) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423134U true JPH0423134U (en]) | 1992-02-26 |
Family
ID=31594233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6383390U Pending JPH0423134U (en]) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423134U (en]) |
-
1990
- 1990-06-15 JP JP6383390U patent/JPH0423134U/ja active Pending